| 摘要 |
<p>A backplane power distribution system for making connections to the power planes of a computer system and having the capability of handling very high levels of current. This is achieved with a stepped backplane construction (17b-e). For example, in a multiple layer system having, in order, a first conductive layer (10a), a first dielectric layer (12a, 12b), a second conductive layer (10b), a second dielectric layer (12bc), and so on, each successive conductive and dielectric layers extend transversely beyond the preceding layers to present a substantial exposed area on all but the first conductive layer (17b-e). Typically, rectangular metal bus bars (not shown) are bolted to the backplane using plated through holes (20b-e) to make contact with the exposed areas (17b-e). Holes through the layers are provided and prepared such that each hole (15, 20 and 22) may make contact with a particular conductive layer as desired or in the case of ground with all ground conductive layers. Conductive layers (10a) and (10i) may be used as signal layers utilizing traces (14) and holes (15) while layers (10b-h) are so-called power planes.</p> |
