| 摘要 |
PURPOSE:To prevent missing or crack of semiconductor pellet during the manufacturing process by forming an SiO2 film up to the scribe line range of semiconductor substrate and overlapping a protection film in the form of staircase adjacent to the scribe line. CONSTITUTION:An SiO2 film is formed on an Si substrate 1 and an SiO2 film 9 is then formed thinner than a film 2 on the scribe line. Then, the Al wiring 4 is provided and protection films 5 are stacked like staircase. When scribing is carried out along the line 8, missing or crack at the periphery of pellet can be prevented. Moreover, short-circuit between inner lead 7 connected to a gold bump 6 and edge 81 of pellet can be prevented. |
