| 摘要 |
PURPOSE:To simplify mounting of elements by providing solder resist in the vicinity of semiconductor element mounting area of conductive plate pattern in a solid state plane circuit. CONSTITUTION:On the occasion of soldering one of ribbon lead terminals of mixer diode 2 to a connecting part 4 of a conductive plate pattern 1, a solder resist 5 is coated on the conductive plate in the vicinity of connecting part 4. The resist 5 specifies width and location of connecting part 4 in view of minimizing required amount of solder and improves efficiency and reliability of soldering. Only a very thin and narrow resist is required, and therefore influence on performance of solid state plane circuit can be neglected. |
