发明名称 |
PROCEDIMENTO PER LA FABBRICAZIONE DI UN CIRCUITO INTEGRATO IBRIDO E CIRCUITO OTTENUTO. |
摘要 |
<p>A hybrid integrated circuit is prepared by laminating an aluminum-copper clad foil on an insulating layer, etching the aluminum-copper clad foil with etching agents to form an aluminum circuit and a copper circuit and connecting a semiconductor element to the aluminum circuit through an aluminum wire or a gold wire while connecting a circuit element to the copper circuit by soldering.</p> |
申请公布号 |
IT8322164(D0) |
申请公布日期 |
1983.07.21 |
申请号 |
IT19830022164 |
申请日期 |
1983.07.21 |
申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
SHINICHIRO ASAI;KAZUO KATOH;TATSUO NAKANO |
分类号 |
H05K3/06;H01L21/48;H01L21/60;H01L23/14;H01L25/16;H05K1/09;H05K3/24;(IPC1-7):H01L/ |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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