| 摘要 |
<p>958,248. Semi-conductor devices. TEXAS INSTRUMENTS Inc. May 6, 1960 [May 6, 1959], No. 46089/63. Divided out of 958,242. Heading H1K. The subject-matter of this Specification is contained in Specification 958,242, but the claims are to a device comprising a plurality of semi-conductor wafers or layers on or in one surface of a substrate which provides electrical isolation between them, each wafer including a region with the electrical properties of at least part of a circuit element. An electrical interconnection, including a conductive lead attached to a wafer or layer surface remote from the substrate, is provided between two of the circuit elements. Specifications 945,734, 958,244, 958,245, 958,246, 958,247 and 958,249 also are referred to.</p> |
