| 摘要 |
PURPOSE:To prevent the short-circuit accident in resin sealing, by joining a wiring plate body to the inner lead top end of lead frames. CONSTITUTION:Wiring patterns 15b are formed on the insulation plate 15a by a plating, etc., then joined to the inner lead top end of the lead frames 12 using a conductive adhesive, and accordingly connected to the electrode of the chip 14. In this constitution, since the connection length can be shortened, the short circuit due to wire contacts can be prevented. |
