发明名称 WIRE BONDING INSPECTION METHOD
摘要 PURPOSE:To improve yield by judging adequacy of wiring condition at the position for supplying lead frame after the wiring and by suspending wire bonding if defective wiring is detected. CONSTITUTION:A lead frame on which wiring 5 is completed by a bonding head 4 is moved as much as mounting interval of a pellet 1, electrode position of pellet is measured by TV camera for industrial use and connecting condition of wire 5, electrode 1a and lead 2a is inspected with reference to the coordinate of electrode. If a defective mode such as large deviation of diameter center of ball of electrode 1a and wire 5 and loop of wire 5, a feeder 3 immediately stops and operation of head 4 is immediately suspended as the measure. This measure improves the yield.
申请公布号 JPS58122744(A) 申请公布日期 1983.07.21
申请号 JP19820004719 申请日期 1982.01.14
申请人 TOKYO SHIBAURA DENKI KK 发明人 OKETA TATSUO;HAZAMANO SHIGEKI
分类号 H01L21/60;H01L21/66 主分类号 H01L21/60
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