| 摘要 |
A glue application device with a nozzle head connected by a feed duct to a glue container and a glue pump by means of which the glue can be conveyed from an outlet nozzle on the nozzle head. A return duct leads from the nozzle head back to the glue container. Two essentially identical glue valves are fitted on the nozzle head, of which valves one has the outlet nozzle and the other leads into the return duct. The glue valves can be controlled alternately, so that when the glue valve with the outlet nozzle is closed, the glue is conducted back into the glue container via the other glue valve and the return duct, the flow resistance being essentially the same as during the outlet of the glue from the outlet nozzle. <IMAGE>
|
