| 摘要 |
PURPOSE:To enable to mount a package IC having high reliability without displacement of the position by forming a recess or projection for positioning the IC and engaging it with the projection or recess formed on a substrate side. CONSTITUTION:A projection 10 which is simultaneously formed at the time of packaging an IC is formed at a package IC 1. Further, a recess 11 which is opened to engage the projection is formed at a substrate side. The position of the recess 11 to the projection 10 is formed so that a terminal 2 is matched to the substrate side terminal 4 which the recess is engaged with the projection. In mounting the flat package IC of this structure, solder cream 12 is first printed at the substrate 3 side. Then, the projection 10 of the flat package IC is engaged with the recess 11 at the substrate side. In this state, the terminal 2 of the flat package IC is positioned to the terminal 4. Since the recess is engaged with the projection even if an impact of certain degree is applied during the time until it reflows in this state, the displacement of the terminal can be prevented. |
