| 发明名称 |
Sputtering apparatus |
| 摘要 |
Herein disclosed is a sputtering apparatus in which a substrate electrode has its electrode surface plate made of a soft magnetic material. The thickness distribution of the film deposited is made uniform by the use of the sputtering apparatus.
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| 申请公布号 |
US4394245(A) |
申请公布日期 |
1983.07.19 |
| 申请号 |
US19820346959 |
申请日期 |
1982.02.08 |
| 申请人 |
HITACHI, LTD. |
发明人 |
HOMMA, YOSHIO;TSUNEKAWA, SUKEYOSHI;MORISAKI, HIROSHI;HARADA, SEIKI |
| 分类号 |
C23C14/34;C23C14/35;C23C14/36;H01J37/34;(IPC1-7):C23C15/00 |
主分类号 |
C23C14/34 |
| 代理机构 |
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代理人 |
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| 地址 |
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