| 摘要 |
PURPOSE:To obtain a head device capable of raising the dot density of a heating element without being restricted by the widthwise dimension of connectors by attaching connectors, e.g., film carriers, etc., in an inclined state to the surface of a base plate. CONSTITUTION:Connectors 5, e.g., film carriers, ceramic or metal plates, etc., are attached in an inclined state to the surfaces of base plates 2 and 3 having a heating element 4, etc. The arranging pitch of the connectors 5, e.g., film carriers, etc., is determined by the thickwise dimension of a bonding tool, but not by the widthwise dimension, and therefore, the connectors 5 can be set at a high density. |
