| 摘要 |
<p>PURPOSE:To obtain the highly reliable resin sealed type semiconductor device by a method wherein a sealing is performed using the epoxy resin composition having excellent dampproof property and high temperature electric characteristics. CONSTITUTION:The semiconductor device is sealed using the hardening material of the epoxy resin composition having, as essential components, novolak type epoxy resin of 170-300 epoxy equivalent (a), novolak type phenol resin (b) and organic phosphine borine or organic borine complex (c). The borine or organic borine complex, to be used as a hardening accelerator, is a blended compound of organic phosphine and borine or organic borine, and it is desirable that the above will be used within the range of 0.01-10wt% for resin component (epoxy resin and phenol resin).</p> |
