Cooling device for disc-shaped semiconductor devices

摘要

A cooling device for disc-shaped semiconductor devices has heat sinks (2) made up of sectors (5 or 10) and said sectors (5 or 10) form one or more cooling ribs (7). The sectors (5) are expediently welded, soldered or bonded together in their central parts. The advantage of this embodiment is that the cooling ribs (7) can be produced with large surfaces with the aid of simple manufacturing methods. <IMAGE>