| 摘要 |
<p>A method of producing a printed circuit comprising printing a planting resist onto the clean surface of a layer of electrically conductive material on at least one side of a substrate so as to leave exposed only the required track areas of the surface; electroplating over the track areas a metal alloy, preferably a palladium/nickel alloy, which will act as an etch resist for the underlying electrically conductive material, which has good solderability, which has a melting point higher than 250 °C, and which will provide a base for gold plate, removing the plating resist; and removing the layer of electrically conductive material from the non-track areas by etching.</p> |
