| 摘要 |
PURPOSE:To make stable production of a solder plated copper wire having a uniform thickness of a plating layer possible in the stage of applying molten solder plating on the copper wire, by oscillating a squeezing wire for molten solder and rolling and drawing the plated copper wire after washing. CONSTITUTION:A copper wire is introduced into a molten solder bath 3 by means of guiding wheels 2, 4, and is taken up perpendicularly with a positioning wheel 5; thereafter, the wire is passed through the hole 7 of a solder squeezing die 6 to squeeze away the molten solder stuck thereon. An ultrasonic oscillator 9 is mounted to the case 8 of the die 6 in this case, and ultrasonic oscillations are applied to the die 6 with an ultrasonic oscillator 10. By the oscillations, the flux residues and oxide stuck on the wire 1 or suspended in the solder 3 are fed together with the wire 1 to the upper part. The wire 1 enters a washing tank 12, and after the flux residues, etc. are washed away with washing liquid such as trichloroethylene or the like, the wire is drawn with a rolling die 14 under water cooling. In this stage the solder plating layer on the surface of the copper wire is made into a uniform thickness by the hole 15. |
