| 摘要 |
<p>PURPOSE:To perform a connection which does not cause breakdown nor shortcircuit by forming a window at a photoresist film on the electrode connecting part of a semiconductor element to an external circuit substrate and coating conductive paste on the window. CONSTITUTION:The end face of a semiconducor element 1 is closely contacted with that of an external circuit substrate 2 which is made of a multilayer ceramic substrate, electrodes 5, 4 of both are positioned, and are bonded fixedly on a base 6. Then, a photoresist film 11 is formed over the entire surfaces of the semiconductor element 1 and the substrate 2, and windows 12 are formed on the electrodes 4, 5. Then, conductive paste 3 is coated and cured on the widows 12, and the film 1 is exfoliated. In this manner, the electrode 5 of the element 1 can be commected to the electrode conductor 4 of the substrate 2 without improper connection.</p> |
