| 发明名称 |
Magnetron cathode sputtering system |
| 摘要 |
In a magnetron cathode sputtering system the target (plate of material to be sputtered) 8 is held against a backing plate 13 by a vacuum, enabling the backing plate 13 to be reused. By providing the backing plate with a layer of soldering material which adheres to the backing plate 13, but does not adhere to the target 8, heat transfer between the two plates is improved.
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| 申请公布号 |
US4392939(A) |
申请公布日期 |
1983.07.12 |
| 申请号 |
US19820369948 |
申请日期 |
1982.04.19 |
| 申请人 |
U.S. PHILIPS CORPORATION |
发明人 |
CROMBEEN, JACOBUS E.;CROOYMANS, PETRUS W. H. M.;VISSER, JAN |
| 分类号 |
C23C14/36;C23C14/34;C23C14/35;H01J37/34;H01L21/00;H01L21/683;(IPC1-7):C23C15/00 |
主分类号 |
C23C14/36 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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