| 摘要 |
PURPOSE:To accurately solder an electronic component to the part where packaging components are crowded by blowing up a solder in advance into the through hole formed on a printed board, inserting the electronic component from the face side of one part of the printed board and projecting a laser light from the face side of the other part. CONSTITUTION:The printed board 40 subjected to a solder dipping in advance and flowing up a solder into a through hole 41 is set to the printed board setting part 10 of a soldering device. The printed board setting part 10 is then moved and the through hole 41 into which the lead wire of the electronic component is inserted is located. The work inserting head is then moved to hold the lead wires 44a, 44b of the electronic component 43 and press-contacted to the solder of the through holes 41a, 41b inside from the face side of one part of the printed board 40. The laser light of a laser light projecting device 30 is then stopped down adequately via lens units 33a, 33b from the face side of the other part of the printed board 30 and projected by inclining a very small angle for the extension direction of the lead wire. |
