| 摘要 |
PURPOSE:To provide a copper alloy spring material of superior conductivity, solderability, corrosion resistance and fatigue strength by laminating a solder material on a copper alloy then cold working these under specific conditions to specific surface roughness. CONSTITUTION:This invention relates to a spring or the like used for communication apparatus, wherein first solder is laminated in various copper alloys of superior conductivity. These are then cold-worked to >=50% reduction ratios to stabilize the roughness of the surface thereof at <=1mu. The copper alloy spring material refers to, for example, phosphor bronze, beryllium copper, Cu-Ni alloys, etc., and the solder material refers to Pb-Sn type two-element alloys, Sn-Ag type, etc. which are lower in m.p. than the metal to be used as a base material. It is possible to provide better spring characteristic by heating the material in the temp. range higher than the m.p. of the solder, for example, higher by about 100 deg.C. |
