| 摘要 |
PURPOSE:To improve recognition rate, by finding correctly the location of a chip from the relative location of plura pads, and finding the location of the chip from the relative location of another pad, if the chip is difficult to recognize a specified pad. CONSTITUTION:The image of a sample 9, for example, a semiconductor chip on a stage 8 is picked up by an ITV camera 2 placed on a wire bonder 1 and the picked up data are binary-coded at a binary coding circuit 3. A location detecting circuit 4 detects a bonding pad based on the binary-coded data obtained at the binary coding circuit 3 and finds the location of the bonding pad. At a location comparator 6, the distance between the pads is found at the location detecting circuit 4 and the location data of a reference pad stored in a reference location memory 5 in advance, and both are compared with each other. When they coincide with each other, the location of the whole chips is found from the found location of pads at a control section 7 and the stage 8 is moved to the location of the pad at which bonding is executed. Thus the bonding is performed. |
