| 摘要 |
A device for transferring leadless components from a carrier type to a given mounting position on a circuit board. Removal of the components from the tape is effected by means of a punch and a suction pick-up. The component is pulled along alignment walls of a feeding channel into a slide chamber of a transfer slide. After having received the component, the slide moves to an end position; the component is lifted by a suction tube into an alignment chamber and is then placed on the circuit board. From the instant of transfer from the tape to the instant of mounting on the circuit board, the component is permanently held by suction due to subatmospheric pressure. Even after withdrawal of the suction pick-up, a subatmospheric pressure is maintained in the slide which holds the component during displacement of the slide until the suction tube lifts it again. From the instant at which it is transferred from the tape to the instant at which it is placed in the mounting position, the component never becomes free again. The alignment of the component is considerably facilitated and improved. A first alignment takes place in the feeding channel and a second alignment in the slide chamber and finally in the alignment chamber. |
