Thin printed circuit board

摘要

The invention relates to the production of a thin printed circuit board which supports at least one electrodeposited copper circuit with connecting points for components. The ends of the connecting leads of the components are inserted through perforations in the printed circuit board and the circuit at the connecting points and connected in an electrically conducting manner with the circuit. The circuit is applied by copper etching of the printed circuit board tin-plated by electrodeposition using negative screen printing. The invention makes it possible to use tin as an etch resist.