Device for making through-contact holes in an electrical printed circuit panel, in particular one based on ceramic substrate.

摘要

To make through-contacts between conductor tracks on either side of a substrate (2) made, for example, of ceramic, a plunger (6) whose diameter is slightly less than that of the hole is introduced into the hole so that a conductor track paste (3) applied to one side of the substrate is sucked into the hole or its edges by underpressure. The process is then repeated from the other side so that the two layers (3) overlap in the hole. In this way it is possible to line the holes perfectly, particularly even complicated configurations of holes. <IMAGE>