| 摘要 |
PURPOSE:To improve the efficiency of cooling by forming a large number of unevenness to a surface contacting with a liquid for cooling of a semiconductor element or a stem. CONSTITUTION:Grooves 7a are formed to the element loading surface of the metallic stem 7 having excellent thermal conductivity in latticed shape, the element 8 is loaded and sealed into a vessel 9, and the liquid 10 having the low melting point and its vapor are enclosed. According to such constitution, the corners of the unevenness of the grooves 7a function as nuclei and the boiling of the liquid 10 is promoted, more evaporization heat is robbed from the element 8, and the efficiency of cooling is improved. The formation of unevenness through the etching of a protective film on the surface of the element is also effective similarly. |
