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发明名称
MEANS FOR COOLING CIRCUIT BOARDS FOLLOWING A SOLDERING OPERATION
摘要
申请公布号
GB2055660(B)
申请公布日期
1983.07.06
申请号
GB19800025824
申请日期
1980.08.07
申请人
SIEMENS AG
发明人
分类号
B23K3/08;H05K3/34;(IPC1-7):B23K3/00
主分类号
B23K3/08
代理机构
代理人
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