| 摘要 |
PURPOSE:To prevent a wiring from damage, package impotence etc. due to slipped location of resin film by a methode wherein the surface of semiconductor elements is coated with resin film. CONSTITUTION:A polyimide film is recommended as a preferable example. The resin film 2 is probided with holes exceeding 1 or 2 piercing itself reaching semiconductor elements. The adhesive reaches the surface of semiconductor elements through these holes with appropriate diameter corresponding to the purpose. These holes must be finally filled with resin etc. in terms of the function filling the role of alpha ray arresting film. Next the adhesive is dropped into the holes of resin film making the resin film adhere to the semiconductor elements. The adhesive is dropped sufficiently to fill the gap between the resin film and semiconductor as well as the holes themselves. The adhesive dropped is habitually hardened meeting the requirements of itself. In case of thermal hardening, the resin film must be heated at the temperature not exceeding the heat resisting temperature thereof. |
