| 摘要 |
<p>PURPOSE:To interconnect two ICs and allow the formation of a hybrid IC having a complex circuit by a device of the same dimension as conventional, by adhesion-fixing springs on a frame body and forming it as a conduction guide. CONSTITUTION:A spring 8 is formed of an element material such as phosphor bronze, and forms a lead frame 10 wherein the central part is bent in a C shape by a punching and a pressing work, and reduces the contact resistance by being Au plated on the C shaped part. Next, the lead frame 10 cur by fitting to the inside of the frame body is cut at the position of chain lines 11, after being fixed at the back surface by an adhesive 9 in a state of being put on the inside of the frame body 7, and thereby the frame body 7 equipped with the spring 8 is formed. Thereat, it is a necessary condition that the upper and lower ends of the spring 8 are respectively projected out from the frame body 7. Then, by adhering both substrate by pressure, using the frame body 7 and the adhesive as conventional, a device wherein both substrate circuits are circuit-connected by a spring 9 can be manufactured.</p> |
