发明名称 DOUBLE HEAT SINK DIODE
摘要 PURPOSE:To eliminate disconnection resulting from heat-caused distortion and short circuits by a method wherein the ratio of the pellet thickness against the bump electrode height is set somewhere between 2.1 and 8.1. CONSTITUTION:A pair of leads with large-diameter ends called slug leads 10 are serially arranged and a pellet 12, an Si-made circuit element, is inserted between the end surfaces of the large-diameter portions 11 of the slug leads 10. The pellet 12 and the large-diameter portions 11 are sealed airtight in a glass tube 13. A surface of the pellet 12 in contact with a large-diameter portion 11 is provided with an Ag-made hemispherical or truncated corn-shaped bump electrode 14 whereby the pellet 12 establishes contact with the other large-diameter portion 11. The relationship between the pellet thickness x and the bump electrode height (thickness) y is set so that the thickness ratio Q=x/y may be somewhere between 2.1 and 8.1, and the bump electrode height y is set at 50mum.
申请公布号 JPS58112345(A) 申请公布日期 1983.07.04
申请号 JP19820207604 申请日期 1982.11.29
申请人 HITACHI SEISAKUSHO KK 发明人 TERAKADO HAJIME;MOROSHIMA HEIJI;YUGAWA OSAMU
分类号 H01L21/60;H01L23/051 主分类号 H01L21/60
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