| 摘要 |
PURPOSE:To contrive the improvement of the availability of an exposure device by a method wherein wafers applied electron beam exposure to the resist face are stored in cure chambrs for a fixed time which is decided by the suitable number of wafers and incoming/outgoing cycle based on exposure time and its variation. CONSTITUTION:Windows 14, 19 are always closed to maintain the airtightness in chambers. After exposure, wafers are successively housed 15 in the chambers 16 in a cure device 13 through the window 14. After fixed time, the wafers are taken out through the window 19. Where, standard exposure time is T, variation d%, cure is C times exposure time, the suitable number of housed wafers (n), and when a wafer completed exposure at (T+d/100XT) is followed by a wafer completed exposure at (T-d/100XT), the maximum space is required. It is acceptable if all the wafers are housed before cure time (T+d/100XT)C. Where, chamber is 1, and when C and (d) are established by (T+d/100XT)C<(T-d/ 100XT)(n-1), the suitable number of housed wafers (n) is decided to permit automatic exposure and cure and to improve the availability of a device. |
