| 摘要 |
PURPOSE:To prevent generation of cavities by a method wherein a laminated material of metal and carbon is superposed at least on one side of the laminated material of an Si plate and brazing metal, a soldering work is performed applying pressure, generated by the difference of thermal expansion between said laminated body and a cramping strut, on the laminated body. CONSTITUTION:The cramping block 13 consists of a carbon layer 15 on the contacting side of a brazing metal laminated body and metal 16 on the remaining part. When the material of the metal 16 is selected and a heat-soldering is performed, the sum of thermal expansion of the carbon supporting member 12, the laminated material 11 and the block 13 is to be maintained at the value not less than the thermal expansion of the strut 8 located between a stand 7 and a press-plate 9. As a result, the pressure which will be determined by the difference of thermal expansion between the two groups of materials above-mentioned is applied to the laminated material when heated up, and the optimum pressuring force can be obtained by a simple means, thereby enabling to prevent generation of cavities at the soldered part and to obtain the highly reliable semiconductor device. |
