| 摘要 |
PURPOSE:To prevent a slippage of the position of outside leads in relation to a vessel of the semiconductor device by a method wherein tips of the outside leads are bent along the inside wall faces of the vessel of the semiconductor element. CONSTITUTION:The bend parts 3a are provided at the tips of the leads 3 along the inside wall faces of the vessel 1. When the leads 3 of a lead frame are fixed to the upper edge faces on the side walls of the vessel 1 with glass solder 4 in this condition, the slippage of the position is not generated. After the leads are fixed, the frame is cut, and the leads 3 are bent according to the prescribed way to complete. |
