| 摘要 |
PURPOSE:To fix outside leads of the plural columns to the base of the semiconductor device in the condition standing in rows by a method wherein a specific melting point temperature metal is used. CONSTITUTION:Au plating is performed previously to the outside leads fixing positions 5 on the base 4 of a package 1 to be used for the semiconductor. After the semiconductor element is fixed to the package and is connected to inside leads, the prescribed melting point metal (Au-Sn, Pb-Ag-Sn eutectic alloy, etc.) 6 is set, and is heated to be molten in the N2 atmosphere of a belt furnace using a jig 7, and the jig is removed to complete. Or concaves 8 are provided at the lead fixing parts, and Au, etc., is plated, a group of leads formed by molding the outside leads 2 with resin 9 is fixed, and to mount to a printed plate, etc., without removing resin 9 is also favorable. According to the method thereof, equipment of the leads can be performed at the final manufacturing process, and the bend of a lead can be prevented. |
