发明名称 Semiconductor device comprising a metallic conductor.
摘要 <p>A material having metallic conduction (hereinafter referred to as a "metallic material" is heteroepitaxially grown in the laminar form on an insulating substrate (11) by molecular beam epitaxy. The resulting metallic material layer (12) is shaped in a desired pattern, whenever necessary. At least a semiconductor layer (13) is heteroepitaxially grown on the metallic material layer (12) and a semiconductor device is fabricated using the semiconductor layer (13). In this case, the metallic material layer (12) is used as one of the electrodes of the semiconductor device.</p>
申请公布号 EP0082325(A2) 申请公布日期 1983.06.29
申请号 EP19820110783 申请日期 1982.11.22
申请人 HITACHI, LTD. 发明人 NAKAGAWA, KIYOKAZU;MURAYAMA, YOSHIMASA;SHIRAKI, YASUHIRO
分类号 H01L29/80;H01L21/203;H01L21/205;H01L21/28;H01L21/331;H01L21/335;H01L21/60;H01L29/73;H01L29/861;(IPC1-7):01L21/28;01L21/203 主分类号 H01L29/80
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