发明名称 |
Soldering methods and apparatus |
摘要 |
Apparatus augmenting a wave soldering machine for mitigating warpage of a printed wiring board after it is processed by the soldering machine comprises heat dissipation means (200) and cooling means (202). The dissipation means directs a first gaseous stream over the a narrow, transverse strip on the underside of the board as it exits a crest of molten solder supplied by the soldering machine. The stream solidifies any liquid solder without disturbing the solder joints. The cooling means directs a second gaseous stream to substantially the centerline region of the board as it exits the dissipation means. The seriatim arrangement of heat reduction means produces a cooling characteristic which is the inverse of the temperature characteristic caused by the soldering operation.
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申请公布号 |
US4390120(A) |
申请公布日期 |
1983.06.28 |
申请号 |
US19800216372 |
申请日期 |
1980.12.15 |
申请人 |
BELL TELEPHONE LABORATORIES, INCORPORATED |
发明人 |
BROYER, ALFRED P. |
分类号 |
B23K3/06;H05K3/34;(IPC1-7):H05K3/34;B23K1/08 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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