FLUX-LESS SOLDERING OF GLASS TO METAL

摘要

- 10 - Case 4342 FLUX-LESS SOLDERING OF GLASS TO METAL A pressure sensitive Silicon chip is indirectly bonded to a Stainless Steel housing of an electronic pressure transmitter through an intermediate holder assembly. This indirect bonding of the Silicon chip prevents thermal cracking of the Silicon chip due to the difference in thermal expansion of the Stainless Steel housing and the Silicon chip. The intermediate holder assembly includes a Borosilicated glass tube having the Silicon chip bonded thereto which tube is soldered to a Nickel-Iron alloy holder by an eutectic alloy solder. The soldering of the glass tube to the Nickel-Iron holder is accomplished without the use of flux due to layers of Chrome, Nickel, and Gold being formed on the glass tube.