Plug-in ceramic hybrid module

摘要

A hybrid circuit module for the modular system constructions of electronic equipment. The module includes a socket that is soldered to a printed wire board and includes a grounding strip and electrical contact terminals. A hybrid circuit fabricated on a ceramic substrate fits within a plastic guide which in turn is fitted to the socket. A plurality of contact pads on the hybrid circuit make electrical contact with the terminals of the socket. A shield can is fitted over the plastic guide and hybrid circuit.