| 摘要 |
PURPOSE:To reduce the pin numbers of the semiconductor device, to lessen the number of wirings between semiconductor devices, and to contrive improvement in reliability of the device, high accuracy of circuit and high-speed operation of the device by a method wherein a battery for semiconductor chip driving is built-in in the package of the device together with the semiconductor chip. CONSTITUTION:The semiconductor chip 12 and the battery 13 are die-bonded on the metal layer 18 which was formed in the package 11. The anode terminal 15 of the battery 13 is wire-bonded on the pad for power source input of the semiconductor chip 12. The input and the output signal pads for semiconductor chip 12 and the grounding pad are wire-bonded to an external lead-out electrode 17, constituting an input electrode pin 20, an output electrode pin 21 and a ground electrode pin 22. They are built-in in the power source package to be used for the driving of the semiconductor chip, the circuit can be instituted by simply connecting the signal input and output terminals only to their respective semiconductor device. |
