| 摘要 |
PURPOSE:To reduce the thermal resistance of the titled device to the minimum as well as to lessen the difference in the thermal expansion coefficient of the device by a method wherein a copper-carbon fiber compound material is used as electrodes and placed above and below a semiconductor element, and an electrode construction is formed in such a manner that the heat generated at the functional part of the semiconductor element will be equally expanded on the upper and the lower sides of the semiconductor element. CONSTITUTION:A semiconductor element 3, whereon a P-N junction was formed, is provided on a cooling fin 1, and electrodes 10 and 11 having an area larger than that of the semiconductor element 3 are prepared by performing a surface treatment such as nickel-plating and the like on the copper-carbon fiber compound material having the thermal expansion coefficient less than twice as much as that of the semiconductor element 3 and also having the thermal conductivity twice or more as much as that of the semiconductor element 3. A lead electrode is adhered to the electrode 11. Then, a terminal base 7 is provided on the cooling fin 1, and the electrode 5 is soldered using a terminal plate 8 and a soldering material 9. After the soldering has been completed, an etching is performed for the purpose of obtaining the withstand voltage characteristics for the semiconductor element 3 using an alkali solution such as NaOH and the like, the above is dried up using nitrogen gas and the like, silicone rubber 6 and the like is filled in and hardened in the air at the temperature of 200 deg.C or above. |
