发明名称 MANUFACTURE OF THERMAL EXPANSION MICROCAPSULE
摘要 PURPOSE:To increase heat resistance and solvent resistance by using a polymer containing specific part by weight of nitrile monomer, non-nitrile monomer and crosslinking agent and preparing a microcapsule volatile expanding agent. CONSTITUTION:(a) 80wt% (hereinafter referred as %), preferably 85-97% of nitrile monomer (Example: acrylonitrile and/or methacrylonitrile, or the like), (b) less than 20%, preferably 10-3% of non-nitrile monomer (Example: methyl methacrylate or the like), (c) 0.1-1%, preferably 0.2-0.5% of crosslinking agent (divinylbenzene or the like) and (d), if necessary, a polymerization initiator are blended together. To this compound, a volatile expanding agent to be gaseous in a temperature of less than softening point of the polymer to be formed is mixed, and the mixture is suspension polymerized in an aqueous medium containing emulsion dispersion auxiliary and the like to prepare microcapsules. Thermal expansion microcapsules are of superb heat resistance and solvent resistance.
申请公布号 JPS62286534(A) 申请公布日期 1987.12.12
申请号 JP19860130602 申请日期 1986.06.04
申请人 MATSUMOTO YUSHI SEIYAKU KK 发明人 YOKOMIZO TERUMASA;TANAKA KOSHI;NIINUMA KIKUO
分类号 B01J13/14;C08J9/32 主分类号 B01J13/14
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