| 摘要 |
PURPOSE:To make the casting process of liquefied resin to be advanced smoothly by a method wherein liquefied resin passing holes to penetrate a substrate are provided in the mutually confronting region of the substrate and the bonded electronic parts. CONSTITUTION:The liquefied resin passing holes 7 to penetrate the substrate 2a are provided in the region corresponding to the electronic parts bonding part of the substrate 2a consisting of an epoxy glass tape. Then the LSI 1 is bonded to the substrate 2a, and liquefied resin 5 is cast therein. Because liquefied resin 5 cast in a gap between the LSI 1 and the substrate 2a can pass the liquefied resin passing holes 7, stagnation of resin is not generated, stagnation of an air bubble is not also generated, and airtight filling-up can be attained easily. After liquefied resin 5 is cast in, and a resin disk 6 is covered on the LSI 1, it is heated in an oven, and liquefied resins 5, 5' are hardened to complete resin sealing. According to sealing method thereof, casting of liquefied resin can be attained by one time, the resin sealing process is simplified, and the working hours are curtailed. |
