| 摘要 |
PURPOSE:To obtain a resin-seales semiconductor device which is adapted for heat sink and flat surface mounting by increasing the thickness of a die pad of a lead frame and forming a projected surface on the lower surface, thereby exposing from the lower surface of a resin sealer. CONSTITUTION:A lead frame 21 is punched from a strip blank 19, leads 22a, 23a, 24a for a cathode, a gate and an anode are formed from a thin part 18, and a die pad 25 is formed from a thick part. An Si element 27 is bonded to the pad 25, and the leads are respectively wired to wirings 11. Subsequently, the ends of the respective leads remain, the element 27 is sealed with resin 26, and the back surface 25a of the pad 25 is exposed. The ends of the respective leads are cut, bent, and formed completely. According to this configuration, a semiconductor device can be reduced in size, in cost, and is adapted for flat surface mounting. The projected surface 25a is contacted with a heat sink mounted externally for the utility, thereby responding to the wide requirements. |
