| 摘要 |
PURPOSE:To reduce the cost of bonding a semiconductor pellet by bonding the back surface of the pellet with the Al deposited layer on the pellet mounting surface of a package via aluminum alloy. CONSTITUTION:An Al deposited layer 2 is formed simultaneously with other wirings on the pellet mounting surface of the base 1 of a ceramic package, an Al deposited layer 4 is also formed on the mounting surface of a pellet 3, and the layers 2, 4 are bonded via an Al alloy layer 5. The layer 5 employs a foil which contains, for example, approx. 0.2% of Ge. According to this configuration, the pellet can be mounted without using an expensive material such as Au, thereby largely reducing the cost. |
