High lead count hermetic mass bond integrated circuit carrier.

摘要

A ceramic carrier for an integrated circuit includes a hermetic electrically insulating substrate 15 having an opening 18, a heat sink 12 attached to the bottom of the integrated circuit 10 and to the back of the substrate 15 to thereby position the integrated circuit 10 in the opening 18, and as many electrically conductive leads 20 as desired attached to the substrate 15 on the opposite side of substrate 15 from heat sink 12. The electrically conductive leads 20 extend across the surface of substrate 15 and into the opening 18 to contact the upper surface of the integrated circuit 10 at desired locations to provide electrical connections to the integrated circuit. The leads 20 may be attached to the integrated circuit 10 by gang bonding using thermocompression.