| 摘要 |
<p>PURPOSE:To prevent break or crack while to enable to automate handling of pellets by a method wherein a holding plate of foaming body, etc., is adhered on the back of a wafer, and the wafer is cut. CONSTITUTION:The holding plate 6 is consisting of a member, the foaming material for example, having high plane holding ability, while enabled to insert easily a needle, etc., and paste 7 is applied to adhere the wafer 2. An air-tight tape 8 of vinyl, etc., is adhered on the back. The wafer 2 is put on a vacuum table 9, and is cut in the measure type making a diamond grindstone 1 to act. The cut wafers 2 are set on a frame type handling jig 12 together with the holding plate 6, and are adhered on the upper face of a strong adhesive tape 13. By thrusting with the upwardly thrusting needle 5 upward from the lower side, the pellets 2a are thrusted up one by one to the upper part of the holding plate 6, and are sucked by a collet 14 positioned in the corresponding position.</p> |
