发明名称 Production of bubble-free electrical laminates
摘要 Bubble- or void-free electrical laminates such as unclad or metal clad laminates are produced by impregnating a porous fibrous substrate with a solvent-free liquid resin capable of curing to a rigid state without producing a volatile by-product, combining a plurality of impregnated substrates to form a unitary member, allowing substantially all of entrapped air bubbles retained in the combination to disappear by dissolving into the liquid resin, and then curing the combination.
申请公布号 US4388129(A) 申请公布日期 1983.06.14
申请号 US19810304692 申请日期 1981.09.22
申请人 KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 OIZUMI, MASAYUKI;ABE, MASAHARU;FUSHIKI, YASUO
分类号 B29C37/00;B32B15/12;B32B38/08;D21H25/06;H05K1/03;H05K3/02;(IPC1-7):B32B31/14 主分类号 B29C37/00
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