发明名称 |
Production of bubble-free electrical laminates |
摘要 |
Bubble- or void-free electrical laminates such as unclad or metal clad laminates are produced by impregnating a porous fibrous substrate with a solvent-free liquid resin capable of curing to a rigid state without producing a volatile by-product, combining a plurality of impregnated substrates to form a unitary member, allowing substantially all of entrapped air bubbles retained in the combination to disappear by dissolving into the liquid resin, and then curing the combination.
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申请公布号 |
US4388129(A) |
申请公布日期 |
1983.06.14 |
申请号 |
US19810304692 |
申请日期 |
1981.09.22 |
申请人 |
KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
OIZUMI, MASAYUKI;ABE, MASAHARU;FUSHIKI, YASUO |
分类号 |
B29C37/00;B32B15/12;B32B38/08;D21H25/06;H05K1/03;H05K3/02;(IPC1-7):B32B31/14 |
主分类号 |
B29C37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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