| 摘要 |
An improved socket assembly is disclosed which is especially suited for use in printed circuitry with dense configuration of components in limited areas of surface. The socket is mounted on an associated printed circuit board and allows horizontal insertion of vertically stacked keyed components, from either side of the socket assembly. The socket assembly further includes a non-metallic insert, consisting of two mating halves containing a plurality of wire contacts of equal geometric diameters, capable of accommodating component leads of differing geometric configurations (i.e., square, rectangular, triangular, round, etc.) which provide pressure to the component lead thereby holding the component in place. The insert is unaffected by the molten solder or flux used during the manufacturing process and prevents entry of contaminating material into the interior of the socket assembly during the soldering process thereby eliminating electrical shorting problems occasionally caused by the soldering process. The insert is surrounded by a U-shaped bracket which acts as a retainer spring on the insert to the socket assembly and is held in place by protrusions extending from the insert which mate with slots in the U-shaped bracket. The socket assembly is inserted into the printed circuit board and is removable from such printed circuit board prior to the soldering process.
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