发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve the productivity because of easy inversion of a flip chip by a method wherein a plurality of flip chips are once arranged as in a direction after splitting, and thereafter they are simultaneously inversed together. CONSTITUTION:A vessel 6 is used to contained flip chips 2, as connection electrodes 3 are turned upward, i.e. the same direction as after splitting, wherein one flip chip is respectively contained in a plurality of pockets 6-1. Since they are contained in the same direction as after splitting and without inversion, the work is easy regarless of handiwork or automatic work by a machine. Neet, the second vessel 7, having the shape approx. the same as the vessel 6 and provided so that pockets 7-1 are opposed to pockets 6-1, is placed on the vessel 6. Thereafter, in a state that the vessel 6 and the second vessel 7 are oppositely contacted each other, the both are reversed up and down. Since the vessel has a large dimension and is not so breakable as a flip chip 2 and without the necessity of care in holding, this inversion work is easy regardless of handiwork or automatic work.
申请公布号 JPS5897839(A) 申请公布日期 1983.06.10
申请号 JP19810197345 申请日期 1981.12.07
申请人 MITSUBISHI DENKI KK 发明人 TACHIKAWA TOORU
分类号 H01L21/68;H01L21/60 主分类号 H01L21/68
代理机构 代理人
主权项
地址