| 摘要 |
PURPOSE:To easily separate a formed film from a base plate, by previously forming a metallic thin-film layer having a low melting point on the surface of the base plate, in a method of forming a formed film consisting of an objective material on the surface of a base plate having a desired shape. CONSTITUTION:For instance, a mask 3 with holes pierced in a desired shape is attached to a Ti base plate 2, and both are set in a electron beam heating type vacuum vapor depositing apparatus 1. Then, after evacuating the inside of the apparatus 1, Al 5 is vapor deposited on the plate 2, as a metallic thin-film layer having a low melting point, by an electric resistance heating system constituted of an electric power source 8 and a device 4. Successively, B7 is formed in the prescribed thickness of said Al thin film layer by an electron-beam 6 heating-system. After cooling, the plate 2 is extracted from the device 1 and is transferred to an atmospheric furnace after removing the mask 3, and is heated in an atomosphere of Ar, etc. formed in the furnace to melt and soften the Al layer. Thus the B-formed-film is separated from the plate 2 without causing cracks and chips. |
