发明名称 CIRCUIT SUBSTRATE WITH HEAT PIPE STRUCTURE
摘要 PURPOSE:To obtain a heat pipe with excellent cooling performance even when employed in electronic apparatus or the like by a method wherein the hollow pipe itself of the heat pipe is made of electrically insulating material. CONSTITUTION:The circuit substrate with heat pipe structure consists of containers 1 made of minute SiC layer, whicks 2 made of porous SiC layer with capillary structure containing a remarkably large number of fine open pores therewithin, which are joined onto the inner wall of the containers 1 by sintering, cavities 3 provided in the wicks 2 and struts 7, which are to support upper and lower substrates 4 and 5 from within the cavities 3 and made of porous SiC. Furthermore, because the cavities 3 in the substrates 4 and 5 are formed by pasting together the two substrates 4 and 5, onto the porous SiC layer or wick 2 recesses are provided, the flat plate circuit substrate with heat pipe structure is manufactured by sealing the surfaces 6 to be pasted together or the side surfaces of the pasting-together part air-tightly and further evacuating the cavities 3 and, after that, enclosing distilled water as working liquid.
申请公布号 JPS5896992(A) 申请公布日期 1983.06.09
申请号 JP19810197134 申请日期 1981.12.07
申请人 HITACHI SEISAKUSHO KK 发明人 MATSUSHITA YASUO;NAKAMURA KOUSUKE
分类号 F28D15/02;H05K1/02 主分类号 F28D15/02
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