发明名称 PLATING DEVICE OF LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make lay on and lay off of the lead frame to a plating jig and lay on and lay off of the jig itself as unnecessary by a method wherein the lead frame is plated during conveyance without using the jig. CONSTITUTION:A lead frame 1 is put on a rubber roller 9 at the inserting part 12 of a plating tank 6. The rotating roller 9 sends the lead frame 1 into the plating tank through slits 15 of the plating tank 6 and a partition plate 14. A plating liquid 5 is sent from a tank 10 into the tank 6 by a pump 11, and although a part thereof flows out from the slit 15, another part dips anode plates 7, the lead frame 1, and a metal roller 16 in the plating liquid, and overflows from the upper part of the partition plates 14. The lead frame 1 is placed between the rollers 9, 16, the plating process is performed during conveyance making the roller 16 as negative and the plates 7 as positive, and the frame is sent out 13 from a slit 15 at the rear. Accordingly plating work is simplified.
申请公布号 JPS5896759(A) 申请公布日期 1983.06.08
申请号 JP19810198250 申请日期 1981.12.04
申请人 MITSUBISHI DENKI KK 发明人 TOKUNAGA TAKAO;BANJIYOU TOSHINOBU
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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